Depending on the processor operational mode, software, environmental conditions, the i.MX 8M Plus SOM may require special thermal management. Largely, this depends on the power consumption of the i.MX 8M Plus device.

For general information on the estimation of the i.MX8M heat dissipation, please refer to the NXP AN13054 i.MX 8M Plus Power Consumption Measurement application note.

For general applications, Emcraft recommends using the Advanced Thermal Solutions ATS-CPX060060006-205-C1-R0 heat sink with an appropriate thermal interface. The 1.0mm T-Global Technology TG-A2200 (TG-A2200-xxx-xxx-1.0) or similar pads can be used. The thermal pad is used to compensate the difference of 0.5mm-0.7mm part heights.

The rectangle 45mm x 55mm pad should be attached on the heatsink symmetrically to its center. The heatsink should be placed on the i.MX 8M Plus SOM/BSB in such a way that the longer side of the thermal pad is parallel to the longer side of the baseboard.

If the thermal performance of the heat sink is not sufficient for a specific customer application, a fan can be used.